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C2012X5R1E106K125AB 0805 106K 25V


C2012X5R1E106K125AB   0805 X5R 25V 10UF 10% 

库存10万型号无法全部上传图片
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C2012X5R1E106K125AB 0805 106K 25V
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0755-29602911
C2012X5R1E106K125AB 0805 106K 25V
兴泰隆电子刘先生18922842911(微信同号)
库存10万型号无法全部上传图片,可以联系实拍图片,快速报价
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C2012X5R1A226MT000N C2012X5R1A226M125AB
C2012X5R1A336MTJ00E C2012X5R1A336M125AC
C2012X5R1A476MTJ00E C2012X5R1A476M125AC
C2012X5R1C106KT0J0E C2012X5R1C106K085AC
C2012X5R1C226KT000E C2012X5R1C226K125AC
C2012X5R1C475KT000E C2012X5R1C475K125AC
C2012X5R1E225KT000E C2012X5R1E225K125AC
C2012X5R1E226MT000E C2012X5R1E226M125AC
C2012X5R1E685KT000N C2012X5R1E685K125AC
C2012X5R1H335KT000N C2012X5R1H335K125AB
C2012X5R1V106KT000E C2012X5R1V106K125AC
兴泰隆电子刘先生18922842911(微信同号)
库存10万型号无法全部上传图片,可以联系实拍图片,快速报价
C2012X5R1V226MT000E C2012X5R1V226M125AC
C2012X5R2A475KT0A0E C2012X5R2A475K125AC
C2012X5R1H475KT000N C2012X5R1H475K125AB
C2012X5R0J476MT000E C2012X5R0J476M125AC
C2012X5R1V106KT0J0E C2012X5R1V106K085AC
C2012X5R1E106KT000N C2012X5R1E106K125AB
C2012X5R1E475KT000N C2012X5R1E475K125AB
C2012X5R1E156MT000E C2012X5R1E156M125AC
C2012X5R1E106KT0J0E C2012X5R1E106K085AC
C2012X5R1H106KT0A0E C2012X5R1H106K125AC
C2012X5R1A226MT0J0E C2012X5R1A226M085AC
C2012X5R1V156MT000E C2012X5R1V156M125AC
C2012X5R1C226MT000E C2012X5R1C226M125AC
C2012X5R1A226MT000S C2012X5R1A226M125AE
C2012X5R1A475KT000N C2012X5R1A475K125AA
C2012X5R0J475KT000N C2012X5R0J475KT000N
兴泰隆电子刘先生18922842911(微信同号)

库存10万型号无法全部上传图片,可以联系实拍图片,快速报价


C2012X5R1E106K125AB




交货型号  ?
C2012X5R1E106KT****
用途
一般等级一般等级
特点
General一般 (~75V)
系列
C2012 [EIA 0805]
状态
量产体制量产体制
品牌
TDK
  • MLCC,积层贴片陶瓷片式电容器:C2012
  • MLCC,积层贴片陶瓷片式电容器
  1. 1
  2. 2

图片仅供参考,并展示示范产品。

尺寸

长度(L)
2.00mm ±0.20mm
宽度(W)
1.25mm ±0.20mm
厚度(T)
1.25mm ±0.20mm
端子宽度(B)
0.20mm Min.
端子间隔(G)
0.50mm Min.
推荐焊盘布局(PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
推荐焊盘布局(PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
推荐焊盘布局(PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

电气特性

电容
10μF ±10%
额定电压
25VDC
温度特性  ?
X5R(±15%)
耗散因数 (Max.)
10%
绝缘电阻 (Min.)
50MΩ

其他

温度范围
-55~85°C
焊接方法
流体
回流
AEC-Q200
NO
包装形式
塑封编带 (180mm卷筒)
包装个数
2000pcs

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